TM120
TM Series 120×90 VOx Uncooled Thermal Module
TM120 is one of the TM series miniature infrared modules developed by XINGHE. It integrates optical lens, 120x90/17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and heat distribution.
TM120 thermal imaging core is oriented for small size, light weight & low price (SWaP) infrared imaging applications. Its super miniature structure and ultralow power consumption are convenient to be integrated into various smart devices, thermal imagers or mobile terminals with strict requirements on cost, size and weight.
Now TM series thermal cores and modules have been widely used in consumer electronics market. It’s easier for TIMO thermal camera core module to be integrated into more terminal products and greatly reduces the cost of customers.
Low Cost & Fast Integration
• Minimum WLP infrared module; size 8.5mm×8.5mm×9.16mm
• DVP Interface, compatible with various embedded platforms
• Visible camera module equivalent for directly integration
• Provide software development kit
Long Operating Time
• Ultra-low power consumption, as low as 10mW
Model | TM120 |
Performance | |
Sensitive Material | Vanadium Oxide |
Resolution | 120×90 |
Pixel Size | 17μm |
Spectral Range | 8～14μm |
FOV | 50°±1°/ 90°±5° |
NETD | ≤60mK |
Frame Rate | 25Hz (Customizable 1～30Hz) |
Focusing Mode | Free |
Measurement & Analysis | |
Temperature Measurement Range | ① Industrial Thermography: -20℃～150℃, 100℃～400℃ (Auto Shift) |
Temperature Measurement Accuracy | ① Industrial Thermography: Greater of ±2℃ or ±2% |
External Interface | 34PIN (FOV: 50°) |
Typical Power Consumption | 45mW@25Hz, 16mW@9Hz, 10mW@≤4Hz |
SDK | Android/ Linux/ Windows |
Environmental Specifications | |
Storage Temperature | -40℃~85℃ |
Certificate | RoHS |
Physical Characteristics | |
Size (mm) | 8.5×8.5×9.16 (FOV: 50°) |
Weight | ≤2g |
